• DocumentCode
    2103046
  • Title

    Three-dimensional FEM simulations of thermomechanical stresses in 1.55 μm laser modules

  • Author

    Deshayes, Y. ; Danto, Y.

  • Author_Institution
    Lab. IXL, Bordeaux I Univ., Talence
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    51
  • Lastpage
    56
  • Abstract
    Deals with results achieved from nonlinear thermomechanical simulations using finite element method (FEM) of a direct modulation 1.55 μm laser module for telecommunication applications. In this paper, two main parts will be developed: evaluation of stresses and strains in the critical zones based on both technological and thermomechanical analyses of the whole laser module (construction design, dissimilar materials, mismatched CTE) and relation between calculated strains and optical misalignment responsible for gradual power drift. Experimental failure analysis will be also conducted to validate thermomechanical simulations, focused in particular on laser weld joints. In this context, both thermal, electrical and thermomechanical simulations on the package must be realized using an original approach based on multiphysics computations of ANSYS software.
  • Keywords
    finite element analysis; modules; semiconductor device packaging; semiconductor lasers; thermal expansion; thermal stresses; 1.55 micron; ANSYS software; critical zones; laser modules; laser weld joints; mismatched CTE; multiphysics computations; nonlinear thermomechanical simulations; optical misalignment; power drift; telecommunication applications; thermomechanical analyses; thermomechanical stresses; three-dimensional FEM simulations; Building materials; Capacitive sensors; Computational modeling; Conducting materials; Finite element methods; Modular construction; Optical design; Power lasers; Thermal stresses; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2002. IPFA 2002. Proceedings of the 9th International Symposium on the
  • Print_ISBN
    0-7803-7416-9
  • Type

    conf

  • DOI
    10.1109/IPFA.2002.1025611
  • Filename
    1025611