DocumentCode
2103046
Title
Three-dimensional FEM simulations of thermomechanical stresses in 1.55 μm laser modules
Author
Deshayes, Y. ; Danto, Y.
Author_Institution
Lab. IXL, Bordeaux I Univ., Talence
fYear
2002
fDate
2002
Firstpage
51
Lastpage
56
Abstract
Deals with results achieved from nonlinear thermomechanical simulations using finite element method (FEM) of a direct modulation 1.55 μm laser module for telecommunication applications. In this paper, two main parts will be developed: evaluation of stresses and strains in the critical zones based on both technological and thermomechanical analyses of the whole laser module (construction design, dissimilar materials, mismatched CTE) and relation between calculated strains and optical misalignment responsible for gradual power drift. Experimental failure analysis will be also conducted to validate thermomechanical simulations, focused in particular on laser weld joints. In this context, both thermal, electrical and thermomechanical simulations on the package must be realized using an original approach based on multiphysics computations of ANSYS software.
Keywords
finite element analysis; modules; semiconductor device packaging; semiconductor lasers; thermal expansion; thermal stresses; 1.55 micron; ANSYS software; critical zones; laser modules; laser weld joints; mismatched CTE; multiphysics computations; nonlinear thermomechanical simulations; optical misalignment; power drift; telecommunication applications; thermomechanical analyses; thermomechanical stresses; three-dimensional FEM simulations; Building materials; Capacitive sensors; Computational modeling; Conducting materials; Finite element methods; Modular construction; Optical design; Power lasers; Thermal stresses; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2002. IPFA 2002. Proceedings of the 9th International Symposium on the
Print_ISBN
0-7803-7416-9
Type
conf
DOI
10.1109/IPFA.2002.1025611
Filename
1025611
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