• DocumentCode
    2111576
  • Title

    On-chip CMOS coplanar transmission line measurements and model verification up to 50 GHz

  • Author

    Goren, D. ; Sheinman, B. ; Woods, W. ; Rascoe, J. ; Shlafman, S.

  • Author_Institution
    IBM Haifa Res. Labs., Haifa
  • fYear
    2008
  • fDate
    13-14 May 2008
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    The results show good agreement between de-embedded measurement and T- line coplanar model in both S-parameters and in Zo representation. In all cases the results of the T-line coplanar model are very close to the corresponding results of the EM solver. The RC model deviates significantly in the frequency domain from the T-line coplanar model results - both in S- parameters and in -Zo representation. The design impact of these deviations depends on the design niche (eg. digital vs. RF), and for a given design niche it may apply only to a given subset of critical wires (eg. clock line, high speed signal line etc.). The criticality of a given wire depends also on the wire length, and the on-chip effective bandwidth (rise time in digital or frequency in RF). For digital designs, the criteria for using a model that includes inductive effects (instead of RC model) was given and discussed previously.The considerations of designing the RF launching structures have been discussed. We have found that a robust optimal design of the RF launching structure allows for the usage of very simple de-embedding techniques up to relatively high frequencies.
  • Keywords
    CMOS integrated circuits; S-parameters; coplanar transmission lines; CMOS integrated circuit; RF launching structures; S-parameters; T-line coplanar model; coplanar transmission line; de-embedding techniques; digital designs; electromagnetic solver; inductive effects; model verification; Clocks; Coplanar transmission lines; Frequency domain analysis; RF signals; Radio frequency; Scattering parameters; Semiconductor device modeling; Signal design; Transmission line measurements; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwaves, Communications, Antennas and Electronic Systems, 2008. COMCAS 2008. IEEE International Conference on
  • Conference_Location
    Tel-Aviv
  • Print_ISBN
    978-1-4244-2097-1
  • Electronic_ISBN
    978-1-4244-2098-8
  • Type

    conf

  • DOI
    10.1109/COMCAS.2008.4562807
  • Filename
    4562807