DocumentCode
2113968
Title
Modeling of the Fabrication and Operation of 3-D Self-Assembled SOI MEMS
Author
Méndez, C. ; Louis, C. ; Paquay, S. ; De Vincenzo, P. ; Klapka, I. ; Rochus, V. ; Iker, F. ; André, N. ; Raskin, J.P.
Author_Institution
Open Eng., Angleur
fYear
2006
fDate
24-26 April 2006
Firstpage
1
Lastpage
5
Abstract
In this paper we present out-of-plane 3D self assembled SOI (silicon-on-insulator) MEMS that can be directly integrated to the electronic components. Because of their 3D nature, these structures can be used, for instance, as the basic elements for the construction of thermal actuators or flow sensors. We make a description of the fabrication and operation of these devices and we show how these two stages can be numerically simulated
Keywords
micromechanical devices; self-assembly; silicon-on-insulator; 3D self-assembled SOI MEMS; electronic components; flow sensors; silicon-on-insulator; thermal actuators; Actuators; Fabrication; Mechanical sensors; Micromechanical devices; Numerical simulation; Shape; Silicon on insulator technology; Temperature; Thermal sensors; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Conference_Location
Como
Print_ISBN
1-4244-0275-1
Type
conf
DOI
10.1109/ESIME.2006.1643957
Filename
1643957
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