Electro-Migration Study in Solder Joint and Interconnects of IC packages

Author

Liang, L.H. ; Xu, Y.J. ; Liu, Y.

Author_Institution

MOE Key Lab. of Mech. Manuf. & Autom., Zhejiang Univ. of Technol., Hangzhou

fYear

2006

fDate

24-26 April 2006

Firstpage

1

Lastpage

7

Abstract

This paper presents a numerical study of electronic migration in solder joint and interconnects metal lines of IC packages. The three dimensional finite element models for interconnect structure on silicon die and a flip chip solder joint structure are developed. These models have been tested through numerical experiment to obtain the electrical, thermal and structural parameters with the migration failure under the loading of high direct current density. An improved advanced algorithm of void formation and propagation in interconnect/solder joints has been developed with consideration of electro-migration, thermo-migration and stress-migration. This improved algorithm is based on direct couple analysis that includes electrical, thermal and structural fields. Then the time to failure life predictions due to mass migration have been simulated based on the voids, current density, temperature and mechanical stress distribution. The simulation results are found to be in good agreement with the experiment data presented in previous work

Keywords

electromigration; finite element analysis; integrated circuit interconnections; integrated circuit packaging; life testing; multidimensional systems; soldering; voids (solid); 3D finite element models; Si; direct couple analysis; electrical parameters; electro-migration; failure life predictions; flip chip; integrated circuit packages; mass migration; mechanical stress distribution; migration failure; silicon die; solder interconnects; solder joint; stress-migration; structural parameters; thermal parameters; thermo-migration; void formation; void propagation; Current density; Electronic packaging thermal management; Electronics packaging; Finite element methods; Flip chip solder joints; Integrated circuit packaging; Silicon; Soldering; Testing; Thermal loading;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on

Conference_Location

Como

Print_ISBN

1-4244-0275-1

Type

conf

DOI

10.1109/ESIME.2006.1643994

Filename

1643994