DocumentCode
2115239
Title
What goes around comes around? High levels of cadmium in low cost jewelry
Author
Streicher-Porte, Martin ; Buckenmayer, Alexandra ; Pfenninger, Susanne
Author_Institution
Swiss Fed. Labs. for Mater. Testing & Res., St. Gallen
fYear
2008
fDate
19-22 May 2008
Firstpage
1
Lastpage
5
Abstract
Low-cost silver jewelry is sold for example in European open-air markets and in specialized shops for traditional handicrafts. While analyzing the material composition of such jewelry, high levels of cadmium were detected. The material composition of 21 samples was analyzed. 12 samples contained 20 percent of cadmium or higher levels (the highest value being 43.9 percent). Lower levels of nickel, copper, zinc and lead were also found. All samples were analyzed for metal migration into artificial sweat solution and 0.07 M hydrochloric acid. Due to the lack of threshold values for cadmium migration in Swiss law, the results were compared to nickel migration (artificial sweat solution) and lead (gastric acid). Compared to this threshold, the measured values for metal migration were excessively high. The vast majority of produced cadmium is used in Nickel/Cadmium cells and other components or substances used in electronic industries. It is out of the question that the observed levels of cadmium could originate from natural cadmium sources (ores). Therefore, it is very likely that inappropriate recycling techniques of electronics and/or nickel/cadmium cells account for the cadmium found in jewelry. A further analysis of cadmium isotopes will equally not clarify the origin of cadmium, as the isotopic fractionation of specific processes or cadmium ores is not accurate enough. In the end, evidence can only be found by describing the production chain of such low cost jewelry.
Keywords
cadmium; cadmium alloys; electronics industry; nickel alloys; recycling; European open-air markets; NiCd; electronic industries; isotopic fractionation; low-cost silver jewelry; natural cadmium sources; nickel-cadmium cells; Cadmium; Composite materials; Copper; Costs; Electronics industry; Nickel; Ores; Recycling; Silver; Zinc; Cadmium; artificial sweat solution; gastric acid; lead silver solder; low cost jewelry; metal migration; nickel-cadmium cells;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 2008. ISEE 2008. IEEE International Symposium on
Conference_Location
San Francisco, CA
Print_ISBN
978-1-4244-2272-2
Electronic_ISBN
978-1-4244-2298-2
Type
conf
DOI
10.1109/ISEE.2008.4562946
Filename
4562946
Link To Document