DocumentCode

2119885

Title

Building memory and sip cubes based on the stacking of rare dice or packaged die

Author

Val, Christian

Author_Institution

3D Plus

Volume

6

fYear

2003

fDate

March 8-15, 2003

Keywords

Biographies; Furnaces; Lead; Packaging; Production; Soldering; Space technology; Stacking; Telephony; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace Conference, 2003. Proceedings. 2003 IEEE

ISSN

1095-323X

Print_ISBN

0-7803-7651-X

Type

conf

DOI

10.1109/AERO.2003.1235178

Filename

1235178