DocumentCode
2120007
Title
An Integrated Simulation Technique For the Modelling of Lumped Elements Using The TLM Method
Author
Albasha, Lutfi ; Snowden, Christopher M.
Author_Institution
Microwave and Terahertz Technology Group, Department of Electronic and Electrical Engineering, University of Leeds, LEEDS, LS2 9JT, UK
Volume
1
fYear
1994
fDate
5-9 Sept. 1994
Firstpage
848
Lastpage
853
Abstract
A new methodology by which the integration of lumped microwave elements into the three dimensional Transmission line matrix method TLM is presented using the standard symmetrical condensed node without the need for adaptively changing the node structure. Problems associated with the implementation are discussed and solutions suggested. Results obtained were compared with predictions of commercially available microwave CAD packages. A new stable method for the extraction of S-parameters from the TLM is also presented and compared favourably with other methods.
Keywords
Circuit simulation; Conductors; Couplings; Finite difference methods; Microwave devices; Microwave theory and techniques; Resistors; Stripline; Strips; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1994. 24th European
Conference_Location
Cannes, France
Type
conf
DOI
10.1109/EUMA.1994.337318
Filename
4138363
Link To Document