Innovative procedures for the evaluation method of the efficiency in the cleaning process

High-quality electronic assemblies, especially with “Fine Pitch” components, frequently need an effective but nonetheless environmentally friendly cleaning process. This paper deals with the development of an evaluation method of cleaning processes in microelectronics assembly technology. The elaboration of optimum parameters of the cleaning process for individual applications and the cleaning process efficiency as well as an innovative methodology based on the use of patented test substrates is in detail described in this paper.