DocumentCode
2123598
Title
AlGaN/GaN power HEMT devices for future energy conversion applications
Author
Liang, Yung C. ; Samudra, Ganesh S. ; Huolin Huang ; Chih-Fang Huang ; Ting-Fu Chang
Author_Institution
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
fYear
2013
fDate
25-26 Feb. 2013
Firstpage
7
Lastpage
10
Abstract
The AlGaN/GaN high electron mobility transistor (HEMT) has drawn great interest in high power and high frequency applications owing to its outstanding material advantages, such as large critical electric field, high electron saturation velocity and the ability to form the high-density two dimensional electron gas (2DEG) conduction channel at the hetero interface. In this paper, a topical review on the device features is made, namely on its polarisation effects that lead to 2DEG formation at the AlGaN/GaN heterojunction, the surface field plate influence and the trap charges induced current collapse phenomenon during pulse operations. These effects are very important in understanding the AlGaN/GaN power HEMT devices.
Keywords
III-V semiconductors; aluminium compounds; gallium compounds; power HEMT; two-dimensional electron gas; wide band gap semiconductors; 2D electron gas conduction channel; 2DEG conduction channel; AlGaN-GaN; electric field; energy conversion; hetero interface; high electron mobility transistor; high electron saturation velocity; polarisation effects; power HEMT device; pulse operation; surface field plate influence; trap charge; Aluminum gallium nitride; Electron traps; Gallium nitride; HEMTs; Logic gates; MODFETs; Piezoelectric polarization;
fLanguage
English
Publisher
ieee
Conference_Titel
Next-Generation Electronics (ISNE), 2013 IEEE International Symposium on
Conference_Location
Kaohsiung
Print_ISBN
978-1-4673-3036-7
Type
conf
DOI
10.1109/ISNE.2013.6512270
Filename
6512270
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