DocumentCode
2124923
Title
Boundary scan testing combined with power supply current monitoring
Author
Kärkkäinen, Matti ; Tiensyrjä, Kari ; Weissenfelt, Matti
Author_Institution
Electron. Lab., Tech. Res. Centre of Finland, Oulu, Finland
fYear
1994
fDate
28 Feb-3 Mar 1994
Firstpage
232
Lastpage
235
Abstract
The monitoring of power supply current is presented for detecting manufacturing defects in printed circuit boards. Simple and inexpensive test equipment consisting of PC and interface card has been developed to support current monitoring by utilizing IEEE 1149.1 standard test architecture
Keywords
automatic test equipment; boundary scan testing; electric current measurement; fault location; microcomputer applications; peripheral interfaces; printed circuit testing; printed circuits; production testing; DFT rules; IDDq; IEEE 1149.1 standard test architecture; JTAG+ method; PC; boundary scan testing; bridging faults; interface card; manufacturing defects; power supply current monitoring; printed circuit boards; Assembly; CMOS technology; Circuit faults; Circuit testing; Current supplies; Logic testing; Monitoring; Power supplies; Printed circuits; Test equipment;
fLanguage
English
Publisher
ieee
Conference_Titel
European Design and Test Conference, 1994. EDAC, The European Conference on Design Automation. ETC European Test Conference. EUROASIC, The European Event in ASIC Design, Proceedings.
Conference_Location
Paris
Print_ISBN
0-8186-5410-4
Type
conf
DOI
10.1109/EDTC.1994.326872
Filename
326872
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