• DocumentCode
    2131456
  • Title

    Design and simulation of micro-tube device in thermal performance for high power LED cooling system

  • Author

    Sheen, Maw-Tyan ; Jean, Ming-Der

  • Author_Institution
    Dept. of Electron. Eng., Yung-Ta Inst. of Technol. & Commerce, Ping-Tung, Taiwan
  • fYear
    2012
  • fDate
    21-23 April 2012
  • Firstpage
    3186
  • Lastpage
    3190
  • Abstract
    This paper reports a micro-tube tank device and FEM simulation using the RGB-based LED design to improve the thermal management of a high power LED arrays. An LED cooling system, using a micro-tube water-cooling device, was successfully designed and simulated. A water-cooling container in the high power LED array gave more efficient convection and the heat created by the LEDs was easily removed in the experiments. It was shown that micro-tube water-cooling systems rendered an improvement in thermal management that effectively decreases the thermal resistance and provides very good thermal dissipation. In addition, both simulation and experimental results show that the LED module with a water-cooling tube exhibits better thermal performances than the others. Accordingly, the results of experiment and simulation demonstrated that a micro-tube water-cooling system is very effective in heat dissipation in LEDs and the fabrication of practical micro-water tube cooling devices for mixing light LEDs was feasible and useful.
  • Keywords
    cooling; finite element analysis; light emitting diodes; thermal management (packaging); FEM simulation; RGB-based LED design; heat dissipation; high power LED arrays; high power LED cooling system; micro-tube tank device; micro-tube water-cooling device; micro-tube water-cooling systems; practical micro-water tube cooling devices; thermal management; thermal performance; thermal resistance; water-cooling container; Finite element methods; Heat sinks; Heat transfer; Light emitting diodes; Thermal management; Water heating; Heat management; Micro-water tube device; White LED light; simulation analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Consumer Electronics, Communications and Networks (CECNet), 2012 2nd International Conference on
  • Conference_Location
    Yichang
  • Print_ISBN
    978-1-4577-1414-6
  • Type

    conf

  • DOI
    10.1109/CECNet.2012.6202160
  • Filename
    6202160