DocumentCode
2132225
Title
Fatigue life analysis for butterfly-shaped cervical spine plates
Author
Kai Ding ; Kai Chen ; Yong-gui Lv ; Yang Chen
Author_Institution
Sch. of Mech. Eng., Hangzhou Dianzi Univ., Hangzhou, China
fYear
2012
fDate
16-18 Oct. 2012
Firstpage
641
Lastpage
644
Abstract
The three-dimensional solid models of butterfly-shaped cervical spine plates were imported into ANSYS software for FEM analysis. According to the anti-fatigue test requirements, the mechanical model was simplified as a pair of compressive load or a bending moment load model for stress cloud calculation. Static FEM analysis was performed for four different types of butterfly-shaped cervical plates, subjected to compressive loads and bending moments respectively. The dangerous nodes with maximum stress were obtained after calculation. Based on the mathematical formula of the S-N curve and Goodman curve, the fatigue life (N) was obtained. It turned out that the stress and strain at the edge of center slot and screw holes are larger than those of the surroundings, and are vulnerable to fatigue fracture. Among four plate types, the fatigue life of three-orifice plate is the largest, and the six-orifice plate the minimum under the same loads.
Keywords
bending; biomechanics; biomedical materials; bone; cloud computing; compressibility; fatigue; fatigue testing; finite element analysis; fracture mechanics; orthopaedics; plates (structures); prosthetics; steel; stress-strain relations; ANSYS software; Goodman curve; S-N curve; antifatigue test requirement; bending moment load model; butterfly-shaped cervical spine plates; center slot; compressive load; fatigue fracture; fatigue life analysis; finite element analysis; mathematical formula; maximum stress; mechanical model; screw holes; six-orifice plate the; static FEM analysis; stress cloud calculation; stress-strain relation; three-dimensional solid models; three-orifice plate; butterfly-shaped; cervical spine plate; fatigue life;
fLanguage
English
Publisher
ieee
Conference_Titel
Biomedical Engineering and Informatics (BMEI), 2012 5th International Conference on
Conference_Location
Chongqing
Print_ISBN
978-1-4673-1183-0
Type
conf
DOI
10.1109/BMEI.2012.6512956
Filename
6512956
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