PCB Ground-Parasitic Effects on a WiMAX Low-Noise Amplifier RFIC

Author

Wu, J.M. ; Lo, C.W. ; Huang, B.Y. ; Yang, N.K. ; Li, S.C.

Author_Institution

Dept. of Electron. Eng., Nat. Kaohsiung Normal Univ., Kaohsiung, Taiwan

fYear

2009

fDate

24-26 Sept. 2009

Firstpage

1

Lastpage

3

Abstract

This paper presents the printed circuit board (PCB) ground-parastic effects on the figure of merit of a WiMAX low noise amplifier (LNA) RFIC. The LNA RFIC is fabricated in 0.35-mum standard SiGe BiCMOS foundry process. The chip size is equal to 0.84 mm times 0.18 mm .The power consumption is 33.6 mW from the supply voltage of 3 V. The PCB ground-parasitic effects act as the source degeneration in the proposed WiMAX LNA and cause the degradation in noise figure (NF) and gain by 0.5 dB and 2.8 dB, respectively. The comparison of simulation and measurement shows good agreement.

Keywords

BiCMOS integrated circuits; WiMax; low noise amplifiers; printed circuits; radiofrequency integrated circuits; BiCMOS foundry process; PCB ground-parasitic effect; WiMAX low-noise amplifier RFIC; power 33.6 mW; power consumption; printed circuit board; size 0.35 mum; voltage 3 V; BiCMOS integrated circuits; Circuit noise; Foundries; Germanium silicon alloys; Low-noise amplifiers; Noise figure; Printed circuits; Radiofrequency integrated circuits; Silicon germanium; WiMAX;

fLanguage

English

Publisher

ieee

Conference_Titel

Wireless Communications, Networking and Mobile Computing, 2009. WiCom '09. 5th International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-3692-7

Electronic_ISBN

978-1-4244-3693-4

Type

conf

DOI

10.1109/WICOM.2009.5303276

Filename

5303276