• DocumentCode
    2134084
  • Title

    A Comparison between Predicted and Experimental Results for Swaged Fin Heat Sinks

  • Author

    Visser, Jan A. ; Zaghlol, Ahmed ; Conradie, Frank D.

  • Author_Institution
    North West Univ., Potchefstroom
  • fYear
    2006
  • fDate
    May 30 2006-June 2 2006
  • Firstpage
    326
  • Lastpage
    332
  • Abstract
    This paper presents a comparison between the simulated and experimental thermal performance of four swaged mixed metal heat sink combinations exposed to forced convection. The four designs consist of all aluminum, all copper, copper base plate/aluminum fin and aluminum base plate/copper fin heat sink. The simulations were carried out using both CFD simulations and a systems CFD approach based on network methodology to simulate the flow distribution and empirical correlations for the heat transfer characteristics. The experiments were conducted within a vertical wind tunnel of Plexiglas walls such that the fins were positioned vertically and parallel to the airflow inside the tunnel. Simulations and experiments were performed for inter-fin Reynolds numbers between 1000 and 5000. The average rise in temperature were simulated and measured at eight locations along the heat sink. The results showed the thermal resistance obtained from the systems CFD approach matches the experimental results through the complete range of Re numbers, while the results obtained from the CFD simulations becomes inaccurate in the transition range between a Re of 2500 and 4500. From the results can be concluded that the all copper heat sink provided the lowest thermal resistance
  • Keywords
    aluminium; computational fluid dynamics; copper; flow; forced convection; heat sinks; heat transfer; CFD simulations; Plexiglas walls; Reynolds numbers; aluminum; copper; flow distribution; forced convection; heat transfer; swaged fin heat sinks; thermal performance; vertical wind tunnel; Aluminum; Computational fluid dynamics; Copper; Electrical resistance measurement; Heat sinks; Heat transfer; Resistance heating; Temperature; Thermal force; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    0-7803-9524-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2006.1645360
  • Filename
    1645360