• DocumentCode
    2134188
  • Title

    Design and Characterization of a Heat Sink Cooled by an Integrated Synthetic Jet Matrix

  • Author

    Gerty, Donavon ; Mahalingam, Raghav ; Glezer, Ari

  • Author_Institution
    Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA
  • fYear
    2006
  • fDate
    May 30 2006-June 2 2006
  • Firstpage
    356
  • Lastpage
    360
  • Abstract
    A novel active heat sink design has been implemented using a matrix of integrated synthetic jets. In previous synthetic jet heat sink designs, cooling air is entrained upstream of the heat sink and is driven along the length of the fins resulting in a significant rise in the air temperature and corresponding drop in stream wise heat transfer effectiveness. In the new design, synthetic jets emanate from the base of the fins so that the induced jets and more importantly the entrained (cooling) ambient air flow along the fin height. The significantly shorter flow path ensures rapid purging and replacement of the heated air with cool entrained air. Furthermore, in the matrix design the jets are spread uniformly throughout the heat sink such that all fin surfaces are subjected to the same airflow. The velocity field of the active heat sink is mapped using particle image velocimetry (PIV) and the configuration that maximizes the volume flow rate through the fins is investigated. Thermal performance is characterized using a surrogate heater and embedded thermocouple sensors. The thermal performance of identical heat sinks cooled by the two synthetic jet approaches is compared
  • Keywords
    cooling; heat sinks; jets; thermocouples; active heat sink; air temperature; airflow; cellular recirculation; cooling; embedded thermocouple sensors; fin surfaces; heat transfer; induced jets; integrated synthetic jet matrix; matrix design; particle image velocimetry; Active matrix technology; Cooling; Fans; Heat pumps; Heat sinks; Heat transfer; Mechanical engineering; Packaging; Power dissipation; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    0-7803-9524-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2006.1645364
  • Filename
    1645364