Evaluation of solid-state temperature control of silicon packages

A metrology which can isothermally control die and package temperature is an essential tool for calibrating temperature sensors. Ovens or isothermal baths are commonly used for temperature calibration, but these pieces of equipment have long throughput times. A calibration method with a shorter TPT has been developed, in which thermoelectric modules are used to control package temperature for temperature sensor calibration. This could enable calibration of all packages individually, and improve the accuracy of thermal testing. A setup was constructed to evaluate the temperature uniformity attained by heating a package with thermoelectric modules and the feasibility of calibration using this method. A major success factor of this setup was its ability to create uniform temperature at the silicon die, and experimental results verified die temperature uniformity was within 0.2 degC for two die sizes. Calibration results from the solid-state metrology matched those obtained using an isothermal liquid bath