• DocumentCode
    2134855
  • Title

    Interconnects and Packaging for MMIC´S

  • Author

    Menzel, Wolfgang

  • Author_Institution
    Microwave Techniques, University of Ulm, D-89069 Ulm, Germany
  • Volume
    1
  • fYear
    1997
  • fDate
    8-12 Sept. 1997
  • Firstpage
    649
  • Lastpage
    654
  • Abstract
    This contribution reviews a number of aspects relevant for interconnects and packaging of monolithic integrated millimeter-wave circuits, possibly combined with hybrid or even waveguide circuits. Topics are packaging and front-end architecture, package materials, and standard interconnects to microstrip or coplanar MIMIC´s. Following this, a special interconnect technique based on electromagnetic field coupling is presented. Finally, as a system application, the front-end of a 77 GHz automotive radar is described.
  • Keywords
    Automotive engineering; Coupling circuits; Electromagnetic coupling; Electromagnetic fields; Electromagnetic waveguides; Integrated circuit interconnections; Microstrip; Millimeter wave circuits; Packaging; Radar applications;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 1997. 27th European
  • Conference_Location
    Jerusalem, Israel
  • Type

    conf

  • DOI
    10.1109/EUMA.1997.337758
  • Filename
    4138916
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2134855