Effect of Loading Mode, Temperature and Moisture on Interface Fracture Toughness of Silicon/Underfill/Silicon Sandwiched System

Author

Song, G.Q. ; Shi, X.Q. ; Qin, F. ; He, C.F.

Author_Institution

Sch. of Civil Eng., Nanchang Univ.

fYear

2006

fDate

May 30 2006-June 2 2006

Firstpage

1147

Lastpage

1152

Abstract

In this study, fracture tests of chip/underfill/chip sandwiched system were carried out, with non-contact and non-destructive digital image correlation (DIC) technique, under various loading angles from 20deg to 90deg different temperature levels of 25, 75 and 125degC or after moisture ageing at 85degRH, to study the effects of loading angle, temperature and moisture on the interface fracture toughness. With the results, the mode I and mode II critical fracture toughness based failure assessment diagrams (FADs) were established for reliability design and failure assessment of underfill/chip interface at different thermal cycling loading and moisture conditions

Keywords

ageing; failure analysis; filled polymers; fracture toughness testing; moisture; nondestructive testing; sandwich structures; semiconductor-insulator-semiconductor structures; 125 C; 25 C; 75 C; digital image correlation; failure assessment diagrams; fracture tests; interface fracture toughness; loading mode effect; moisture ageing; moisture effect; reliability design; silicon-underfill-silicon sandwich system; temperature effect; underfil-chip interface; Aging; Digital images; Electronic equipment testing; Electronic packaging thermal management; Flip chip; Moisture; Partial response channels; Silicon; Temperature; Thermal loading;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on

Conference_Location

San Diego, CA

ISSN

1087-9870

Print_ISBN

0-7803-9524-7

Type

conf

DOI

10.1109/ITHERM.2006.1645474

Filename

1645474