DocumentCode
2138009
Title
Thermal Properties of Metal-Coated Vertically-Aligned Single Wall Nanotube Films
Author
Panzer, M. ; Zhang, G. ; Mann, D. ; Hu, X. ; Pop, E. ; Dai, H. ; Goodson, K.E.
Author_Institution
Stanford Univ., CA
fYear
2006
fDate
May 30 2006-June 2 2006
Firstpage
1306
Lastpage
1313
Abstract
Owing to their extraordinarily high thermal conductivities, carbon nanotubes (CNTs) are promising for use in advanced thermal interface materials (TIMs). While there has been much previous research on carbon nanotube thermal properties, there are little data for aligned films of single wall nanotubes. This paper measures the thermal interface resistances of metal-coated vertically-aligned single wall CNT (SWNT) arrays using a nanosecond pump/probe thermoreflectance technique. The data capture the vertical variation of CNT thermal properties including their interface resistances. The data show the total thermal resistance of the TIM is R"swnt,tot=1.2 times 10-5 m2 KW-1, and that the CNT-metal interface resistance strongly reduces the effective vertical thermal conductivity. An approximate model shows that the evaporated metal film contacts only a small fraction of the CNTs. Based on the conclusions of the model, the individual CNT-metal contact conductance is hcnt-metal,a=6.6 times 107 Wm-2K-1 which is quite good. Increasing the number of CNT-substrate contacts is a very promising approach for improving the thermal performance of CNT-based interface materials
Keywords
carbon nanotubes; contact resistance; thermal conductivity; thermal resistance; thermoreflectance; carbon nanotubes; single wall nanotubes; thermal conductivity; thermal interface materials; thermal interface resistances; thermal properties; thermoreflectance thermometry; Acoustic materials; Carbon nanotubes; Conducting materials; Impedance; Organic materials; Temperature; Thermal conductivity; Thermal management; Thermal resistance; Thermoreflectance;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location
San Diego, CA
ISSN
1087-9870
Print_ISBN
0-7803-9524-7
Type
conf
DOI
10.1109/ITHERM.2006.1645496
Filename
1645496
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