• DocumentCode
    2142402
  • Title

    Research on SiGeC power diodes with fast and soft recovery

  • Author

    Liu, Jing ; Gao, Yong ; Yang, Yuan

  • Author_Institution
    Dept. of Electron. Eng., Xian Univ. of Technol., Xian, China
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    180
  • Lastpage
    183
  • Abstract
    A novel type of p+(SiGeC)-n--n+ diodes with ultra fast and ultra soft reverse recovery characteristics is presented. The improvement of the novel diodes is achieved by the combination of new device structure and new semiconductor material. Based on the introduction of `ideal ohmic contact¿, the softness factor increases over four times, the reverse recovery time is over 60% short and the reverse peak current is reduced about 35%, while the blocking voltage is almost unchanged for the device with the optimized n- region doping concentration. Due to the addition of smaller-sized carbon atoms to p+(SiGe) layers, the dependence of device characteristics on critical thickness is reduced largely, which increases the device stability reduces process cost for further device process steps.
  • Keywords
    Ge-Si alloys; ohmic contacts; power semiconductor diodes; semiconductor materials; SiGeC; blocking voltage; device stability; ideal ohmic contact; n-region doping concentration; p+-n--n+ diodes; power diodes; reverse peak current; ultra soft reverse recovery time; Atomic layer deposition; Cathodes; Costs; Germanium silicon alloys; Ohmic contacts; P-i-n diodes; Semiconductor diodes; Silicon germanium; Stability; Voltage; SiGeC; critical thickness; softness factor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734503
  • Filename
    4734503