• DocumentCode
    2142554
  • Title

    From ultimate to beyond NanoCMOS

  • Author

    Deleonibus, S. ; De Salvo, B. ; Ernst, T. ; Faynot, O. ; Royer, C. Le ; Poiroux, T. ; Vinet, M.

  • Author_Institution
    Electron. Nanodevices Lab., MINATEC, Grenoble, France
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    207
  • Lastpage
    210
  • Abstract
    The microelectronics industry is facing historical challenges to down scale CMOS devices through the demand for low voltage, low power and high performance. The implementation of new materials and devices architectures will be necessary. HiK gate dielectric and metal gate are among the most strategic options to implement for power consumption and low supply voltage management. Multigate architectures increase MOSFETs drivability, reduce power, and allow new memory devices opportunities to develop future applications. By introducing new materials(HiK, Ge, III-V, Carbon based materials like diamond, graphene and CNTs, molecules,...), Si based CMOS will be scaled beyond the ITRS as the system-on-chip platform.
  • Keywords
    CMOS integrated circuits; MOSFET; carbon nanotubes; diamond; graphene; low-power electronics; system-on-chip; C; CMOS devices; Ge; HiK gate dielectric; MOSFET; Si; carbon nanotubes; diamond; graphene; low power electronics; low supply voltage management; low voltage electronics; microelectronics industry; nanoCMOS; power consumption; system-on-chip; Diamond-like carbon; Dielectric materials; Energy consumption; Energy management; III-V semiconductor materials; Low voltage; MOSFETs; Microelectronics; Organic materials; Power system management; CMOSFETs; Diamond; Flash Memories; Germanium; Nanocrystals; Silicon on insulator technology; Strain; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734508
  • Filename
    4734508