DocumentCode
2142554
Title
From ultimate to beyond NanoCMOS
Author
Deleonibus, S. ; De Salvo, B. ; Ernst, T. ; Faynot, O. ; Royer, C. Le ; Poiroux, T. ; Vinet, M.
Author_Institution
Electron. Nanodevices Lab., MINATEC, Grenoble, France
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
207
Lastpage
210
Abstract
The microelectronics industry is facing historical challenges to down scale CMOS devices through the demand for low voltage, low power and high performance. The implementation of new materials and devices architectures will be necessary. HiK gate dielectric and metal gate are among the most strategic options to implement for power consumption and low supply voltage management. Multigate architectures increase MOSFETs drivability, reduce power, and allow new memory devices opportunities to develop future applications. By introducing new materials(HiK, Ge, III-V, Carbon based materials like diamond, graphene and CNTs, molecules,...), Si based CMOS will be scaled beyond the ITRS as the system-on-chip platform.
Keywords
CMOS integrated circuits; MOSFET; carbon nanotubes; diamond; graphene; low-power electronics; system-on-chip; C; CMOS devices; Ge; HiK gate dielectric; MOSFET; Si; carbon nanotubes; diamond; graphene; low power electronics; low supply voltage management; low voltage electronics; microelectronics industry; nanoCMOS; power consumption; system-on-chip; Diamond-like carbon; Dielectric materials; Energy consumption; Energy management; III-V semiconductor materials; Low voltage; MOSFETs; Microelectronics; Organic materials; Power system management; CMOSFETs; Diamond; Flash Memories; Germanium; Nanocrystals; Silicon on insulator technology; Strain; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4734508
Filename
4734508
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