Interface failure in lead free solder joints

Author

Darveaux, Robert ; Reichman, Corey ; Islam, Nokibul

Author_Institution

Amkor Technol., Inc., Chandler, AZ

fYear

0

fDate

0-0 0

Abstract

The phenomenon of interface failure in lead free solder joints was explored using solder joint array tensile testing. The effects of pad metallization, solder alloy, reflow conditions, and post reflow thermal aging were quantified. The joint strength ranged from 5 to 115MPa. The joint ductility dropped to zero in some cases. The interface microstructure and failure mode were characterized for each combination of factors. Most of the trends were linked to microstructural features of the interface. A ductile-to-brittle transition strain rate (DTBTSR) was defined as a metric to quantify the performance of a specific joint relative to interface failure. The DTBTSR ranged from 10^-3 /sec to 10/sec for the conditions studied

Keywords

ductile-brittle transition; ductility; failure (mechanical); failure analysis; metallisation; reflow soldering; tensile testing; 5 to 115 MPa; ductile-to-brittle transition strain rate; failure mode; interface failure; interface microstructure; joint ductility; lead free solder joints; pad metallization; post reflow thermal aging; reflow conditions; solder alloy; tensile testing; Capacitive sensors; Computer interfaces; Electric shock; Electronic equipment testing; Environmentally friendly manufacturing techniques; Lead; Loading; Packaging; Sockets; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

1-4244-0152-6

Type

conf

DOI

10.1109/ECTC.2006.1645763

Filename

1645763