Wafer thinning solution for wafer-level-capped MEMS devices

Author

Lacsamana, E.S. ; Mena, M.G. ; Navarro, R.M. ; Kuan, N. ; Spooner, T.R.

Author_Institution

Micromachined Products Div., Analog Devices Inc., Cavite

fYear

0

fDate

0-0 0

Abstract

A wafer backgrinding solution is demonstrated to successfully thin wafer-level-capped MEMS accelerometers down to 250mum thickness. Capped MEMS wafers are prepared for manufacturing by using wafer protective tapes. Holes are punched on layers of tape, matching the thickness of the caps, that serve as gap fills in-between caps and through the wafer edge. The capped wafers are fully supported while processing using standard backgrinding machines. Manufacturing issues and corresponding fixes to attain satisfactory result are also discussed. The thinned capped accelerometer device is packaged in a 4times4mm leadframe chip scale package (LFCSP) to check its performance

Keywords

accelerometers; chip scale packaging; grinding; microsensors; wafer bonding; 250 micron; 4 mm; MEMS accelerometers; capped MEMS wafers; leadframe chip scale package; wafer backgrinding solution; wafer protective tapes; wafer thinning; Accelerometers; Chip scale packaging; Electronics packaging; Integrated circuit technology; Manufacturing; Microelectromechanical devices; Micromechanical devices; Packaging machines; Protection; Semiconductor device packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

1-4244-0152-6

Type

conf

DOI

10.1109/ECTC.2006.1645793

Filename

1645793