Thermal analysis of ICs based on equivalent thermal resistance

Author

Su, Rong ; Feng, Shiwei ; Guo, Chunsheng ; Zhang, Bin ; Meng, Hao ; Zhang, Guangchen

Author_Institution

Sch. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China

fYear

2008

fDate

20-23 Oct. 2008

Firstpage

456

Lastpage

459

Abstract

The paper presents a new method to analyze the steady-state temperature distribution of integrated circuit. According to the application of ANSYS, aiming at the complicated model and large calculation amount of very large scale integrated circuits, we present a new concept defined as equivalent thermal resistance. Based on the equivalent thermal resistance, the temperature distribution of an analog integrated circuit is calculated. And the result is verified by doing a complete ANSYS analysis.

Keywords

CMOS analogue integrated circuits; temperature distribution; thermal analysis; thermal resistance; ANSYS; analog integrated circuit; equivalent thermal resistance; steady-state temperature distribution; thermal analysis; Analog integrated circuits; Circuit simulation; Electronic packaging thermal management; Integrated circuit modeling; Semiconductor device modeling; Steady-state; Temperature distribution; Thermal conductivity; Thermal resistance; Very large scale integration; Equivalent thermal resistance; analog integrated circuit; temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-2185-5

Electronic_ISBN

978-1-4244-2186-2

Type

conf

DOI

10.1109/ICSICT.2008.4734562

Filename

4734562