DocumentCode
2146406
Title
Using time-aware memory sensing to address resistance drift issue in multi-level phase change memory
Author
Xu, Wei ; Zhang, Tong
Author_Institution
ECSE Dept., Rensselaer Polytech. Inst., Troy, NY, USA
fYear
2010
fDate
22-24 March 2010
Firstpage
356
Lastpage
361
Abstract
Because of its great scalability potential and support of multi-level per cell storage, phase change memory has become a topic of great current interest. However, recent studies show that structural relaxation effect makes the resistance of phase change material drift over the time, which can severely degrade multi-level phase change memory storage reliability. This paper studies the potential of using a time-aware memory sensing strategy to address this challenge. The basic idea is to keep track of memory content lifetime and, when memory is being read, accordingly adjust the memory sensing configuration to minimize the negative impact of time-dependent resistance drift on memory storage reliability. Because multi-level phase change memory may demand the use of powerful error correction code (ECC) whose decoding can request either hard-decision or soft-decision log-likelihood (LLR) memory sensing, we discuss both hard-decision and soft-decision time-aware memory sensing in details. Using BCH code and LDPC code as ECC for 4-level/cell and 8-level/cell phase change memory, we carry out simulations and the results show that, compared with time-independent static memory sensing, time-aware memory sensing can increase allowable memory content lifetime by several orders of magnitude.
Keywords
BCH codes; error correction codes; integrated circuit reliability; parity check codes; phase change memories; BCH code; ECC; LDPC code; LLR memory sensing; address resistance drift issue; memory content lifetime; multilevel per cell storage; multilevel phase change memory storage reliability; powerful error correction code; soft-decision log-likelihood memory sensing; structural relaxation effect; time-aware memory sensing; time-dependent resistance drift; Amorphous materials; Crystalline materials; Crystallization; Error correction codes; Material storage; Parity check codes; Phase change materials; Phase change memory; Random access memory; Scalability; BCH; LDPC; Multi-level phase change memory; structural relaxation; time-aware sensing;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2010 11th International Symposium on
Conference_Location
San Jose, CA
ISSN
1948-3287
Print_ISBN
978-1-4244-6454-8
Type
conf
DOI
10.1109/ISQED.2010.5450549
Filename
5450549
Link To Document