Thermal analysis of circuit boards and microelectronic components using an analytical solution to the heat conduction equation

Author

Ellison, Gordon N.

Author_Institution

Thermal Comput. Inc., Newberg, OR, USA

fYear

1996

fDate

5-7 Mar 1996

Firstpage

144

Lastpage

150

Abstract

An analytical solution to the three-dimensional heat conduction equation is adapted to the analysis of printed circuit boards and component packages. A Fourier series solution coupled with an integrated thermal network is used to predict substrate surface temperatures and heat loss via interconnecting leads. The resultant solutions have been coded into the TAMS (Thermal Analyzer for Multi-layer Structures) and PTAMS (Pcb TAMS) computer programs. An example of a multi-chip module on an epoxy-glass coupon is used to illustrate the methodology. This paper summarizes several previously published articles as well as indicating new pre/post-processing capability

Keywords

Fourier series; heat conduction; integrated circuit packaging; multichip modules; printed circuits; thermal analysis; Fourier series; PTAMS; TAMS; computer program; epoxy-glass coupon; heat loss; integrated thermal network; interconnecting lead; microelectronic component package; multi-chip module; multilayer structure; printed circuit board; substrate surface temperature; thermal analysis; three-dimensional heat conduction equation; Circuit analysis; Equations; Geometry; Heat transfer; Microelectronics; Packaging; Printed circuits; Temperature; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE

Conference_Location

Austin, TX

ISSN

1065-2221

Print_ISBN

0-7803-3139-7

Type

conf

DOI

10.1109/STHERM.1996.545104

Filename

545104