• DocumentCode
    2150157
  • Title

    Package Effects Caused by Leaky Modes at Higher Frequencies in Microwave Integrated Circuits

  • Author

    Oliner, Arthur A.

  • Author_Institution
    Department of Electrical Engineering, Polytechnic University, Brooklyn, NY, USA
  • Volume
    3
  • fYear
    1999
  • fDate
    Oct. 1999
  • Firstpage
    122
  • Lastpage
    125
  • Abstract
    When a microwave integrated circuit is placed in a package, the leakage properties of the transmission lines can change significantly, and these package effects may produce new physical behavior or simply cause leakage to occur at a lower frequency than one would expect.
  • Keywords
    Coplanar waveguides; Crosstalk; Dispersion; Distributed parameter circuits; Frequency; Integrated circuit packaging; Leaky wave antennas; Microstrip; Microwave integrated circuits; Power transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 1999. 29th European
  • Conference_Location
    Munich, Germany
  • Type

    conf

  • DOI
    10.1109/EUMA.1999.338543
  • Filename
    4139566
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2150157