• DocumentCode
    2153391
  • Title

    SPI proceedings: Investigation of the interactions between vias and the power-bus

  • Author

    Heinrich, Gerd ; Dickmann, Stefan

  • Author_Institution
    Univ. der Bundeswehr Hamburg, Hamburg
  • fYear
    2009
  • fDate
    12-15 May 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Physics-based models are widely used for the description of vias in multilayer PCBs. In this paper, such a lumped model for a via in a 4-layer PCB and the extraction of its elements are described. Furthermore, the undesired interactions between the via and the power-bus in a 4-layer PCB are investigated using the calculation of a combined lumped model and measurements of S-parameters.
  • Keywords
    S-parameters; printed circuits; S-parameters; lumped model; multilayer PCBs; physics-based models; power-bus; printed circuit board;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2009. SPI '09. IEEE Workshop on
  • Conference_Location
    Strasbourg
  • Print_ISBN
    978-1-4244-4490-8
  • Electronic_ISBN
    978-1-4244-4489-2
  • Type

    conf

  • DOI
    10.1109/SPI.2009.5089841
  • Filename
    5089841
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2153391