On the quantification and improvement of the models for surface roughness

Predictability of transmission line parameters is very important for microelectronics packaging. Surface roughness can cause a drastic deviation in transmission line parameters from the ideal theoretically calculated values. State-of-the-art analytical and full-wave surface roughness models have been helpful in closing this gap but they have considerable limitations, especially when applied to certain types of thin-film structures. This work analyzes some state-of-the-art surface roughness models and quantifies their limitations. A new approach to surface roughness characterization is then presented.