• DocumentCode
    2154719
  • Title

    Modelling of 3D Multilayer Coplanar Waveguide Structure with Incorporated Wideband Vertical Interconnection

  • Author

    Mahmood, M.R. ; Hu, Z.R.

  • Author_Institution
    Student Member, IEEE, Department of Electronic Engineering, King´´s College London, University of London, Strand, London, WC2R 2LS, United Kingdom. mohd.mahmood@kcl.ac.uk
  • fYear
    2000
  • fDate
    Oct. 2000
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The characteristics of three-dimensional (3D) multilayer coplanar waveguide (CPW) lines incorporating a 90° vertical interconnection structure have been investigated using a full wave analysis. Possible coupling effects between CPW lines in different layers have been taken into account, with results showing that such effects could be very strong if the adjacent CPW lines are too close. As the distance between the adjacent lines increases, the coupling effects become weak; nevertheless it is not completely negligible for many practical applications. Equivalent circuits including such weak coupling effects which comprises of mixed lumped components and transmission lines have been developed. A good agreement with the full wave analysed results over ku, k and ka bands has been achieved. In addition to fundamental propagation mode, higher order mode effects have also been examined. The simulation results indicate that the second or third order modes might become dominant propagation mode at higher frequency depending upon the CPW structure and its layer distance.
  • Keywords
    Coplanar waveguides; Coupling circuits; Dielectric substrates; Distributed parameter circuits; Equivalent circuits; Frequency; Integrated circuit interconnections; Nonhomogeneous media; Silicon; Wideband;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2000. 30th European
  • Conference_Location
    Paris, France
  • Type

    conf

  • DOI
    10.1109/EUMA.2000.338746
  • Filename
    4139759