Interconnects for a Multi-Layer Three-Dimensional Silicon Architecture

As low cost and low volume gain increasing importance in today´s technology market, the development of a silicon micro-machined multi-layer transmit module has become a worthwhile endeavor. In this architecture, the MMICs are flip-chip bonded and the 94 GHz signal is distributed both laterally and vertically through three silicon layers resulting in excitation of a four by four array of patch antennas. This module is 6 mm in length, 6 mm in width, 1 mm in height, and represents the first W-band transmit module to date. The details of the passive components and interconnects will be presented in this paper.