A novel 2-D wind sensor with thermal feedback

Author

Shen, Guang-Ping ; Qin, Ming ; Dong, Ziqiang ; Huang, Qing-An

Author_Institution

Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China

fYear

2008

fDate

20-23 Oct. 2008

Firstpage

2399

Lastpage

2402

Abstract

The design and fabrication of a novel 2-D wind sensor as well as the interface circuits and test results were presented in this paper. A novel constant temperature difference (CTD) mode control circuits with thermal feedback was proposed, and full bridge circuits were used for wind measurement. It was fabricated on the ceramic substrate, and direct chip attach (DCA) packaged to the substrate. The wind tunnel test results show that the wind sensor can measure wind speeds up to 35 m/s with an accuracy of 0.3 m/s, and wind direction in a full range of 360Â° with a resolution within 5Â°.

Keywords

atmospheric techniques; bridge circuits; chip scale packaging; thermal analysis; velocity measurement; wind; wind tunnels; 2D wind sensor; ceramic substrate; constant temperature difference mode control circuits; direct chip attach packaging; full bridge circuits; interface circuits; thermal feedback; wind measurement; wind speed measurement; wind tunnel test; Bridge circuits; Ceramics; Circuit testing; Fabrication; Feedback circuits; Packaging; Semiconductor device measurement; Temperature control; Temperature sensors; Thermal sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-2185-5

Electronic_ISBN

978-1-4244-2186-2

Type

conf

DOI

10.1109/ICSICT.2008.4735054

Filename

4735054