Low ringing I/O buffer design

This paper describes the design of a new I/O buffer architecture, allowing low ringing at the presence of inductive package noise. A simple and accurate model of the I/O buffer can be used to help semi-custom users foresee PAD behavior under different load and inductive packaging situations. Analysis results and simulations of the behavioral model were validated by a discrete prototype. The new buffer design reached higher frequencies without noise degradation when compared with traditional buffer design