Interaction between chip and its packaging waveguide at millimetre wave frequencies

A novel packaging technique employing waveguides as both packaging cases and interconnection media between chips has been investigated using 3D electromagnetic simulator. No bond wires are needed in this packaging technique and, consequently, it can be used in millimetre wave circuits and systems. It was found from simulation that mono-mode operation, realized through the optimisation of substrate thickness in relation to the waveguide dimensions, is necessary for a successful design. Quasi-single mode operation with extended bandwidth can be achieved.