• DocumentCode
    2161220
  • Title

    A high performance drying method enabling clustered single wafer wet cleaning

  • Author

    Mertens, P.W. ; Doumen, G. ; Lauerhaas, J. ; Kenis, K. ; Fyen, W. ; Meuris, M. ; Arnauts, S. ; Devriendt, K. ; Vos, R. ; Heyns, M.

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    2000
  • fDate
    13-15 June 2000
  • Firstpage
    56
  • Lastpage
    57
  • Abstract
    A novel fast drying method for single wafer wet cleaning is proposed. The water-mark free drying method is based on an efficient interaction between Marangoni forces and rotational forces. The method is shown to yield excellent particle performance.
  • Keywords
    cluster tools; drying; surface cleaning; Marangoni force; clustered single wafer wet cleaning; drying method; particulate contamination; rotational force; Availability; Cleaning; Degradation; Manufacturing processes; Process control; Production; Testing; Time factors; Timing; US Department of Transportation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 2000. Digest of Technical Papers. 2000 Symposium on
  • Conference_Location
    Honolulu, HI, USA
  • Print_ISBN
    0-7803-6305-1
  • Type

    conf

  • DOI
    10.1109/VLSIT.2000.852768
  • Filename
    852768
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2161220