• DocumentCode
    2162273
  • Title

    Advanced shallow trench isolation to suppress the inverse narrow channel effects for 0.24 /spl mu/m pitch isolation and beyond

  • Author

    Horita, K. ; Kuroi, T. ; Itoh, Y. ; Shiozawa, K. ; Eikyu, K. ; Goto, K. ; Inoue, Y. ; Inuishi, M.

  • Author_Institution
    ULSI Dev. Center, Mitsubishi Electr. Corp., Hyogo, Japan
  • fYear
    2000
  • fDate
    13-15 June 2000
  • Firstpage
    178
  • Lastpage
    179
  • Abstract
    A novel shallow trench isolation (STI) technique named Poly-Si-Buffered-mask STI (PB-STI) using the SiN/poly-Si/SiO/sub 2/ stacked mask has been proposed. The poly-Si is oxidized at the step of liner oxidation and then a "small bird\´s beak" is grown. With small bird\´s beak formation the oxide recess at the trench edge is prevented and the fringing of electric-field from the gate electrode can be effectively avoided. PB-STI can completely suppress the inverse narrow channel effect with quite simple process sequence which includes no corner implantation.
  • Keywords
    elemental semiconductors; isolation technology; masks; oxidation; silicon; silicon compounds; STI technique; Si; SiN-Si-SiO/sub 2/; SiN/poly-Si/SiO/sub 2/ stacked mask; advanced shallow trench isolation; electric-field; inverse narrow channel effect; inverse narrow channel effects; liner oxidation; oxide recess; poly-Si; poly-Si-buffered-mask STI; small bird beak; trench edge; Birds; Electrodes; Filling; Isolation technology; MOSFETs; Oxidation; Research and development; Silicon compounds; Threshold voltage; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 2000. Digest of Technical Papers. 2000 Symposium on
  • Conference_Location
    Honolulu, HI, USA
  • Print_ISBN
    0-7803-6305-1
  • Type

    conf

  • DOI
    10.1109/VLSIT.2000.852816
  • Filename
    852816