Low Cost Millimeter Wave Transmitter Based on SMT Techniques

Author

Ortega-González, Francisco Javier ; Asensio-López, Alberto ; Torregrosa-Penalva, German

Author_Institution

Universidad Polit?cnica de Madrid, Ctra. Valencia km7, 28031, Madrid. e-mail: fjortega@diac.upm.es, Phone: 34 649 24 23 75, fax: 34 91 336 77 84

fYear

2001

fDate

24-26 Sept. 2001

Firstpage

1

Lastpage

4

Abstract

The aim of this paper is to present a millimeter wave transmitter (Ka band) designed to be manufactured using low cost, surface mountable millimeter wave components onto soft PTFE based substrates. The system employs recently developed millimeter wave monolithic integrated circuits (MMICs) packaged in surface mountable Ball Grid Arrays (BGA) for the low power subsystems and surface mountable Land Grid Arrays (LM packages) for the driving power stages, mainly the power amplifiers. Tailored active bias servos are also employed to improve efficiency and reliability and to reduce adjustments and manufacturing costs also. Output power compression point of P1dB = 26dBm and Power Added Efficiency PAE=18 % have been measured at 31 GHz.

Keywords

Costs; Integrated circuit packaging; Land surface; MIMICs; Millimeter wave technology; Monolithic integrated circuits; Pulp manufacturing; Surface waves; Surface-mount technology; Transmitters;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2001. 31st European

Conference_Location

London, England

Type

conf

DOI

10.1109/EUMA.2001.339054

Filename

4140122