Improvement in sidewall roughness of MEMS X-ray optics

Author

Ikuta, Masahiro ; Ezoe, Yuichiro ; Mitsuishi, Ikuyuki ; Ogawa, Tomomi ; Kakiuchi, Takuya ; Ohashi, Takaya ; Mitsuda, Kazuhisa

Author_Institution

Dept. of Phys., Tokyo Metropolitan Univ., Tokyo, Japan

fYear

2013

fDate

18-22 Aug. 2013

Firstpage

113

Lastpage

114

Abstract

Low-cost and high-resolution X-ray optics based on MEMS technologies is proposed and being developed by our group. We have succeeded in soft X-ray imaging using sample optics. However, roughness of the side walls etched through a thin silicon wafer, which are used as X-ray mirrors, limited the image resolution. In this paper, a new process condition is tested in the dry etching process to achieve better resolution. By simply changing the etching mask from aluminum to thick photoresist plus aluminum, the side wall roughness is improved by a factor of ~3 to about 38 nm at 200 um scale.

Keywords

X-ray imaging; X-ray optics; aluminium; elemental semiconductors; etching; image resolution; micro-optomechanical devices; micromirrors; photoresists; silicon; Al; MEMS X-ray optics; Si; X-ray mirrors; dry etching process; etching mask; high-resolution X-ray optics; image resolution; photoresist; sample optics; sidewall roughness; soft X-ray imaging; thin silicon wafer; Annealing; Etching; Micromechanical devices; Optics; Resists; Silicon; X-ray imaging; Al film; DRIE; photoresist; sidewall roughness;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical MEMS and Nanophotonics (OMN), 2013 International Conference on

Conference_Location

Kanazawa

ISSN

2160-5033

Print_ISBN

978-1-4799-1512-5

Type

conf

DOI

10.1109/OMN.2013.6659085

Filename

6659085