DocumentCode
2165497
Title
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
fYear
2000
fDate
21-24 May 2000
Abstract
The following topics were dealt with: automated assembly; optoelectronic modules; flip-chip processing; wafer-level packaging; solder technology; passive components; optical alignment techniques; electrical and thermal modeling; underfill materials; chip-scale packaging; reliability testing; RF components; optoelectronic packaging; high density chip and PWB technologies; material characterization and modeling; MEMS packaging and bonding technology; power distribution and EMI modeling; low cost good die; plating and under bump materials; adhesives; MCM technology; electronics packaging education; lead-free interconnects, solders and conductive adhesives; connectors and contacts; BGA packaging; parallel optical interconnects
Keywords
packaging; electronic components; packaging technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV, USA
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853094
Filename
853094
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