Wide band organic solutions for MMIC packaging

Author

Barbier, T. ; Caban-Chastas, D. ; Rananjason, V. ; Kertesz, P.

Author_Institution

Thales Airborne Syst., Elancourt, France

fYear

2005

fDate

12-17 June 2005

Abstract

This paper describes packages solutions developed to integrate MMICs which operate from 2GHz to 20GHz. These chip scale nonhermetic packages are made up of organic based material and are dedicated to assembly onto organic multilayers. Three solutions are presented, two involving ball grid array (BGA) interfaces, and one using a lead frame for thermal dissipation requirements. This last one enables to integrate high power dissipation (about 10W) MMIC. The RF transition improvement is described and performance obtained by measuring packaged MMICs with these solutions is presented. Environmental evaluation results are discussed for the based lead frame interface package. Finally, a 3D package taking benefits from the solutions firstly developed is presented.

Keywords

MMIC; assembling; ball grid arrays; chip scale packaging; organic compounds; 2 to 20 GHz; MMIC measurement; MMIC packaging; RF transition improvement; ball grid array interfaces; chip scale nonhermetic packages; environmental evaluation; high power dissipation; organic multilayers; thermal dissipation; wide band organic solutions; Assembly; Electronic packaging thermal management; Electronics packaging; Lead; MMICs; Microwave technology; Nonhomogeneous media; Organic materials; Radio frequency; Wideband;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2005 IEEE MTT-S International

ISSN

01490-645X

Print_ISBN

0-7803-8845-3

Type

conf

DOI

10.1109/MWSYM.2005.1517179

Filename

1517179