DocumentCode
2166652
Title
Advanced packaging technologies in MOSFETs for power management
Author
Tsui, Anthony ; Sarkis, Jingo ; Chen, Howard
Author_Institution
Vishay Siliconix, Santa Clara, CA, USA
fYear
2000
fDate
2000
Firstpage
147
Lastpage
150
Abstract
The existing consumer electronic market demands an overall system miniaturization, and in particular miniaturization of power conversion circuits and their associated power MOSFETs. This has created a need for smaller devices with higher power performance, yet without sacrificing power performance. Advanced silicon technologies combined with surface mount power packages are designed to serve the ever-increasing demands placed on power designers
Keywords
power MOSFET; semiconductor device packaging; surface mount technology; consumer electronics; miniaturization; power MOSFET; silicon technology; surface mount package; Circuits; Consumer electronics; Electronics packaging; Energy management; MOSFETs; Power conversion; Power system management; Silicon; Surface-mount technology; Technology management;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853138
Filename
853138
Link To Document