DocumentCode
2166851
Title
An Investigation of the Proximity Effect of Millimeter-Wave MMICs in Flip-Chip Configuration
Author
Nagy, Oliver ; Heide, Patric ; Springer, Andreas ; Weigel, Robert
Author_Institution
Siemens AG, Corporate Technology, D-81730 Munich, Germany, email: oliver.nagy@ieee.org, Phone: ++ 49 89 636 48230, Fax: ++ 49 89 636 46881
fYear
2001
fDate
24-26 Sept. 2001
Firstpage
1
Lastpage
4
Abstract
A comparison between flip-chip mounting of monolithic microwave integrated circuits (MMICs) in microstrip transmission line technology and coplanar transmission line technology is presented. The influence of substrate proximity effects on the electrical behavior of the MMICs is examined and illustrated in normalized frequency independent graphs. Based on the results of this work, the performance of microstrip-MMICs used in flip-chip configuration can be estimated as a function of the chosen assembly geometry.
Keywords
Coplanar transmission lines; Integrated circuit technology; MMICs; Microstrip; Microwave integrated circuits; Microwave technology; Millimeter wave integrated circuits; Millimeter wave technology; Monolithic integrated circuits; Proximity effect;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2001. 31st European
Conference_Location
London, England
Type
conf
DOI
10.1109/EUMA.2001.339156
Filename
4140224
Link To Document