• DocumentCode
    2167839
  • Title

    Motivating Model Checking of Embedded Systems Software

  • Author

    Reinbacher, Thomas ; Kramer, Michael ; Horauer, Martin ; Schlich, Bastian

  • Author_Institution
    Dept. of Embedded Syst., Univ. of Appl. Sci. Technikum Wien, Wien
  • fYear
    2008
  • fDate
    12-15 Oct. 2008
  • Firstpage
    546
  • Lastpage
    551
  • Abstract
    The design paradigm shift observed in nowadays embedded software engineering from low level assembly code to high level languages enables ever more advanced applications. With the unprecedented level of actual design and implementation complexity, traditional concepts such as software testing and debugging are reaching their limits of useful application for the verification of ultra-high reliable embedded software. This paper addresses the problems that arise when using C-code for embedded targets and emphasizes the need of detailed knowledge of the underlying hardware architectures. Furthermore, model checking of assembly code is motivated and utilized to find errors in the code that are not obvious at the C-code level and will only occur on very rare occasions in the field. For that purpose we make use of the model checker [mc]square, developed by the RWTH Aachen University, and show some concepts to overcome the traditional model checking showstopper - the state-explosion problem.
  • Keywords
    embedded systems; program testing; program verification; software engineering; embedded software engineering; embedded systems software; hardware architectures; high level languages; model checking; software debugging; software reliability; software testing; Application software; Assembly; Design engineering; Embedded software; Embedded system; High level languages; Reliability engineering; Software design; Software systems; Software testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechtronic and Embedded Systems and Applications, 2008. MESA 2008. IEEE/ASME International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2367-5
  • Electronic_ISBN
    978-1-4244-2368-2
  • Type

    conf

  • DOI
    10.1109/MESA.2008.4735653
  • Filename
    4735653