• DocumentCode
    2167886
  • Title

    First 80 nm SON (Silicon-On-Nothing) MOSFETs with perfect morphology and high electrical performance

  • Author

    Monfray, Stephane ; Skotnicki, Thomas ; Morand, Yves ; Descombes, S. ; Paoli, Mario ; Ribot, P. ; Talbot, A. ; Dutartre, D. ; Leverd, F. ; Lefriec, Y. ; Pantel, Roland ; Haond, M. ; Renaud, D. ; Nier, M.-E. ; Vizioz, C. ; Louis, D.

  • Author_Institution
    France Telecom, CNET, Grenoble, France
  • fYear
    2001
  • fDate
    2-5 Dec. 2001
  • Abstract
    In this paper, the first 80 nm SON MOSFETs are presented, demonstrating the electrical viability of the SON architecture. The transistors have a 20 nm thick Si-film channel, isolated from the bulk by a 20 nm dielectric layer. The electrical results show significant improvement (/spl sim/30%) compared with bulk reference devices. In particular, drive current and transconductance are improved due to the better effective field-inversion charge compromise, and SCE due to the thinness of the junctions and of the channel. These electrical results are then used to calibrate the ISE simulator and to make predictions on SON performances with more aggressive gate length and Tox. These predictions show the potential of the SON architecture for future CMOS generations.
  • Keywords
    MOSFET; electric admittance; semiconductor device measurement; surface structure; 20 nm; 80 nm; 80 nm Si-on-nothing MOSFETs; ISE simulator calibration; SCE; SON architecture; Si; dielectric layer; drive current; electrical performance; electrical results; electrical viability; field-inversion charge compromise; future CMOS generations; gate length; localized SOI areas; morphology; transconductance; Electronic mail; Epitaxial growth; Etching; Germanium silicon alloys; Hafnium; MOSFETs; Microelectronics; Morphology; Silicon germanium; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-7050-3
  • Type

    conf

  • DOI
    10.1109/IEDM.2001.979591
  • Filename
    979591