• DocumentCode
    2171910
  • Title

    Packaging aspects of the LitebusTM parallel optoelectronic module

  • Author

    Freitag, Ladd ; Kuczynski, Joseph ; Fortier, Paul ; Guindon, Francois ; Letourneau, Martial ; Chan, Benson ; Sherman, John ; Johnson, Glen ; Demangone, Drew ; Mentzer, Mark ; Naghski, David ; Trostle, Brian

  • Author_Institution
    IBM Corp., Rochester, MN, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    1259
  • Lastpage
    1265
  • Abstract
    The Litebus module is an optoelectronic transceiver and the key component in a parallel fiber optic data link. The module is designed to extend computer-to-computer communications to data rates and link distances beyond those achievable in copper at comparable cost. A transceiver configuration was selected to keep the module´s size compact (45 mm×32 mm× 9.8 mm) and to facilitate the integration of an IEC Class 1 laser safety strategy. The Litebus module consists of various packaging components and both CMOS and optoelectronic dies. It is designed to accept a single connector, having one receive and one transmit section, that is mounted on the end of a dual 12 channel fiber optic ribbon cable. Channel-to-channel spacing is 250 μm throughout and standard multimode fiber is used. The transmitter consists of a VCSEL (Vertical Cavity Surface Emitting Laser) source having a wavelength of 850 nm. The receiver consists of a transimpedance amplifier with integrated Metal-Semiconductor-Metal (MSM) detector. The module´s transmit and receive sections were designed to operate at data rates greater than 1.25 Gb/s (gigabits per second) per channel, yielding a maximum aggregate data rate in excess of 15 Gb/s. In one mode of operation, byte-wide data is simultaneously transmitted from and received by the module at 1.25 GB/s (gigabytes per second), with the four remaining channels on each side being assigned to user-defined overhead functions. The maximum cable length is 400 m in asynchronous mode and 200 m in synchronous mode
  • Keywords
    integrated optoelectronics; optical communication equipment; optical interconnections; packaging; transceivers; Litebus; computer-to-computer communication; optoelectronic transceiver; packaging; parallel fiber optic data link; parallel optoelectronic module; Copper; Costs; Fiber lasers; IEC standards; Optical fiber cables; Optical fibers; Packaging; Surface emitting lasers; Transceivers; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-5908-9
  • Type

    conf

  • DOI
    10.1109/ECTC.2000.853335
  • Filename
    853335