DocumentCode
2173485
Title
Transient analysis of bridge microhotplate
Author
Saxena, Gaurav ; Paily, Roy
Author_Institution
Dept. of Electron. & Electr. Eng., Indian Inst. of Technol. Guwahati, Guwahati, India
fYear
2013
fDate
21-23 Sept. 2013
Firstpage
328
Lastpage
330
Abstract
For the transient analysis of bridge membrane, a lumped element model is developed. The developed model is employed for analyzing the effect of increased thermal mass on the thermal time response and steady state power consumption. The model is compared with the FEM simulation results and is in close agreement, with a maximum error of 3.2% and 8% in transient response and power calculations respectively. With 8 μm thick nitride layer, the time constant has increased by 72.95%.
Keywords
electric heating; micromechanical devices; transient analysis; bridge membrane; bridge microhotplate; lumped element model; steady state power consumption; thermal mass; thermal time response; transient analysis; Bridge circuits; Capacitance; Insulation; Steady-state; Thermal resistance; Transient analysis; Bridge membrane; lumped element model; microhotplate; steady state power consumption; transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Electronic Systems (ICAES), 2013 International Conference on
Conference_Location
Pilani
Print_ISBN
978-1-4799-1439-5
Type
conf
DOI
10.1109/ICAES.2013.6659422
Filename
6659422
Link To Document