• DocumentCode
    2173503
  • Title

    Multi-filling approach for the improvement of thermoelectric properties of skutterudites

  • Author

    Chen, L.D. ; Tang, X.F. ; Kawahara, T. ; Dyck, J.S. ; Chen, W. ; Uher, C. ; Goto, T. ; Hirai, T.

  • Author_Institution
    Shanghai Inst. of Ceramics, Acad. Sinica, Shanghai, China
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    57
  • Lastpage
    60
  • Abstract
    Several skutterudite antimonides filled with atoms of different kinds, (Ba, M)yCo4Sb12 (M=Ce, La, Sr), have been synthesized by the combination of solid state reaction and melting methods. Thermal conductivity of (Ba,Sr)yCo4 Sb12 samples shows a behavior similar to that of BayCo4Sb12. Adding a small amount of Ce or La to the BayCo4Sb12 system is effective in further reducing the lattice thermal conductivity. The difference in the ionic radii of the two co-filler atoms is the most sensitive factor for scattering of phonons. The multi-filled (Ba, M)yCo4Sb12 (M=Sr, Ce, La) show lower Seebeck coefficients as compared to the single-filled BayCo 4Sb12 having the same total filling fraction. It is expected that higher thermoelectric performance could be realized by further optimization of the composition of filler species
  • Keywords
    Seebeck effect; barium compounds; cerium; cobalt compounds; lanthanum; phonon-impurity interactions; strontium; thermal conductivity; BaCeCo4Sb12; BaCo4Sb12; BaLaCo4Sb12; BaSrCo4Sb12; Seebeck coefficients; filler species composition; ionic radii; lattice thermal conductivity; melting methods; multi-filling approach; phonon scattering; skutterudite antimonides; skutterudites; solid state reaction; thermal conductivity; thermoelectric properties; total filling fraction; Atmospheric measurements; Ceramics; Conducting materials; Filling; Laboratories; Lattices; Phonons; Powders; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
  • Conference_Location
    Beijing
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-7205-0
  • Type

    conf

  • DOI
    10.1109/ICT.2001.979821
  • Filename
    979821