An efficient wire sweep analysis solution for practical applications

Wire sweep is one of the IC packaging defects that CAE tools have been applied for years by many researchers. Meanwhile, various methodologies have been introduced to get better prediction and matching to the experimental measurements. These studies mostly emphasized on the accuracy of the wire sweep calculation. The discussions about analysis efficiency, especially for the high pin-count package (100, 208 leads or more), are seldom touched. This study introduces a practical wire sweep analysis solution not only to meet the need of accuracy but also enhance the efficiency for actual applications. Coupling the design philosophy of these two needs, an in-house wire sweep analysis software (InPack) was developed. This software combines global flow analysis (C-MOLD) and structure analysis (ANSYS) to become a solution for general wire sweep evaluation. The wire geometry modeling procedure is neglected to improve the analytical efficiency. In addition, the multi-layer data requisition criteria is captured to simulate the actual flow conditions around a wire inside the mold cavity. With the Select (Input)-Execute-and-See user interface, the cycle time of wire sweep problem analysis is significantly reduced in practical application