• DocumentCode
    2176805
  • Title

    APD-based measurement technique to estimate the impact of noise emission from electrical appliances on digital communication systems

  • Author

    Abidin, A. N Zainal ; Abdullah, W. R Wan ; Chuah, T.C. ; Jenu, M.Z.M. ; Ramli, A.

  • Author_Institution
    EMC & Power Quality Program, TM Res.&Dev. Sdn. Bhd., Malaysia
  • fYear
    2008
  • fDate
    10-12 Dec. 2008
  • Firstpage
    139
  • Lastpage
    142
  • Abstract
    This paper describes a technique to measure noise emissions from electrical appliances and study their impact towards digital communication systems by using the amplitude probability distribution (APD) methodology. The APD has been proposed within CISPR for measurement of electromagnetic noise emission. We present a measurement approach which utilizes a programmable digitizer with an analysis software to evaluate the noise APD pattern and probability density function (PDF). A unique noise APD pattern is obtained from each measurement of noise emission from different appliances. The noise PDF is useful for noise modeling and simulation, from which we can estimate the degradation on digital communication performance in terms of bit error probability (BEP). This technique provides a simple platform to examine the effect of other electrical appliances noise emission towards specific digital communication services.
  • Keywords
    digital communication; domestic appliances; electrical products; electromagnetic interference; error statistics; noise; amplitude probability distribution methodology; analysis software; bit error probability; digital communication systems; electrical appliances; electromagnetic noise emission; probability density function; programmable digitizer; Density measurement; Digital communication; Electric variables measurement; Electrical products; Electromagnetic interference; Electromagnetic measurements; Measurement techniques; Noise level; Noise measurement; Probability distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-2633-1
  • Electronic_ISBN
    978-1-4244-2634-8
  • Type

    conf

  • DOI
    10.1109/EDAPS.2008.4736019
  • Filename
    4736019