• DocumentCode
    2178994
  • Title

    Modeling and Analysis Techniques of Jitter Enhancement Across High-Speed Interconnect Systems

  • Author

    Beyene, Wendemagegnehu

  • Author_Institution
    Rambus Inc., Los Altos
  • fYear
    2007
  • fDate
    29-31 Oct. 2007
  • Firstpage
    29
  • Lastpage
    32
  • Abstract
    Although it is well understood that a band-limited passive system can be a source of deterministic jitter, it is less obvious that the deterministic and random jitters generated by the clock or data source can be enhanced significantly by the passive channel. In this paper, modeling and simulation techniques to predict jitter enhancement across interconnect systems are presented. The conventional method of using SPICE to calculate output jitter is computationally expensive. Instead, the effect of channel on input jitter can be represented by jitter impulse response or jitter transfer function in time or frequency domains, respectively. These jitter characteristic functions can then be used to efficiently determine the increase in jitter as signal propagates across an interconnect system. The probability mass function of jitter impulse response can also be constructed to statistically predict the jitter enhancement at lower bit-error rate. Finally, the results form SPICE-based simulation and those obtained using the jitter characteristic functions are compared.
  • Keywords
    SPICE; integrated circuit interconnections; integrated circuit modelling; probability; timing jitter; transfer functions; transient response; SPICE; band-limited passive system; bit-error rate; deterministic jitters; high-speed interconnect systems; impulse response; jitter enhancement; jitter transfer function; probability mass function; random jitters; Bit error rate; Circuit simulation; Clocks; Communication system signaling; Integrated circuit interconnections; Jitter; Predictive models; SPICE; Signal to noise ratio; Transfer functions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2007 IEEE
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    978-1-4244-0883-2
  • Type

    conf

  • DOI
    10.1109/EPEP.2007.4387115
  • Filename
    4387115